Foreign-Trade Zone (FTZ) 183, Notification of Proposed Production Activity; Ichor Systems, Inc.; (Semiconductor Equipment); Austin, Texas

Ichor Systems, Inc. submitted a notification of proposed production activity to the FTZ Board (the Board) for its facility in Austin, Texas within FTZ 183. The notification conforming to the requirements of the Board's regulations (15 CFR 400.22) was received on July 30, 2026.

Pursuant to 15 CFR 400.14(b), FTZ production activity would be limited to the specific foreign-status material(s)/component(s) and specific finished product(s) described in the submitted notification (summarized below) and subsequently authorized by the Board. The benefits that may stem from conducting production activity under FTZ procedures are explained in the background section of the Board's website—accessible via www.trade.gov/​ftz.

The proposed finished products include: shutoff or control valves for gas panel of semiconductor wafer fabrication equipment; gas panels for semiconductor wafer fabrication equipment/machines; weldments for gas panels of semiconductor wafer fabrication equipment (vaporizer, gas lines); assembly kits of gas panel for semiconductor wafer fabrication equipment/machines; stainless steel tube/pipe fittings; hand-operated valves for gas panels; parts of hand-operated gas valves for gas panels; other parts of gas valves for gas panels; pressure-reducing valves; gas filtering/purifying machinery; automatic regulating instruments/apparatus; optical fiber cables; parts of filtering/purifying machinery for gas panels; electrical switches installed onto gas panels; stainless steel seamless pipe/tube used for the assembly of gas panels; larger stainless steel seamless pipe/tube (>19mm) used for the assembly of gas panels; flexible tubing of iron or steel used for the assembly of gas panels; stainless steel butt welding fittings used for the assembly of gas panels; rubber hoses reinforced with textile materials used for the assembly of gas panels; stainless steel seamless tubes/pipes used for the assembly of gas panels; smaller stainless steel welded pipe/tube (<1.65mm) used for the assembly of gas panels; insulated electric conductors with connectors used for the assembly of gas panels; ignition wiring sets and other wiring sets used for the assembly of gas panels; electrical plugs or sockets or connectors used for the assembly of gas panels; stainless steel flanges used for the assembly of gas panels; steel springs used for the assembly of gas ( printed page 54693) panels; stainless steel threaded elbows/bends/sleeves used for the assembly of gas panels; steel weldments used for the assembly of gas panels; gas panels for manufacture of semiconductor devices; pneumatic power valves; gas valves for semiconductor equipment; glass for gas panel windows; insulated electric conductors with connectors; gas panels for semiconductor wafer fabrication equipment; automatic regulating instruments/apparatus; stainless steel bars/rods; stainless steel seamless tube/pipe; back planes and gas or chemical panel frames for semiconductor manufacturing equipment; stainless steel butt welding fittings used for the assembly of gas panels; stainless steel seamless tube/pipe used for the assembly of gas panels; mechanical seals used for the assembly of gas panels; gas valves used for the assembly of gas panels; wired glass sheets used for the assembly of gas panels; wooden crates used to package gas panels for shipping; processing units for adp machines; steel weldments for semiconductor equipment; and parts of machinery for working rubber/plastics used for the assembly of gas/chemical panels (duty rate ranges from duty-free to 5.6%).

The proposed foreign-status materials/components include: polymer-based prepared adhesive compound in liquid or paste form used for bonding and sealing semiconductor equipment assemblies and fluid handling hardware; plastic bar (nylon hexago) used in semiconductor manufacturing, fluid handling, vacuum processing, or industrial automation applications; rigid polyvinyl chloride plastic pipe or tube used for industrial chemical distribution and process utility systems in semiconductor fabrication facilities; extruded plastic tube, pipe, hose, elbow, coupling, or connector fitting used in semiconductor gas, liquid chemical, or vacuum delivery systems; rigid or flexible polyethylene plastic tubing and hose used for low-pressure chemical and gas transfer applications in semiconductor manufacturing equipment; pressure-sensitive plastic sheet, tape, film, or adhesive-backed material used for insulation, sealing, masking, or protective applications in semiconductor manufacturing; polycarbonate plastics used in semiconductor manufacturing, fluid handling, vacuum processing, or industrial automation applications; polyurethane plastics used in semiconductor manufacturing, fluid handling, vacuum processing, or industrial automation applications; molded plastic container, bag, tray, cap, closure, or packaging article used for handling, protecting, and transporting semiconductor components and assemblies; molded plastic container, bag, tray, cap, closure, or packaging article of polymers of ethylene used for handling, protecting, and transporting semiconductor components and assemblies; fabricated plastic articles including spacers, retainers, insulators, guards, or protective hardware used in semiconductor process equipment; vulcanized rubber gasket, seal, o-ring, or sealing ring designed for vacuum integrity and chemical containment in semiconductor fluid handling systems; industrial labels used in semiconductor manufacturing, fluid handling, vacuum processing, or industrial automation applications; industrial felt (polyester) or nonwoven textile pad used for filtration, insulation, vibration damping, or protective lining in semiconductor manufacturing equipment; technical ceramic tube, insulator, chamber component, or wear-resistant article used in semiconductor process and vacuum systems; deionized water tank used in semiconductor electrical and thermal management applications; fabricated glass or quartz article including windows, covers, shields, or chamber components used in semiconductor manufacturing equipment; fabricated stainless-steel bar, plate, tube, fastener, spring, or structural article used in semiconductor manufacturing equipment assemblies (electroslag or vacuum arc remelted); fabricated stainless-steel bar, plate, tube, fastener, spring, or structural article used in semiconductor manufacturing equipment assemblies (containing 8percent or more but less than 24 percent by weight of nickel); fabricated stainless-steel bar, plate, tube, fastener, spring, or structural article used in semiconductor manufacturing equipment assemblies; fabricated stainless-steel bar, plate, tube, fastener, spring, or structural article used in semiconductor manufacturing equipment assemblies (less than 18mmand containing 8 percent or more but less than 24 percent by weight of nickel); fabricated stainless-steel bar, plate, tube, fastener, spring, or structural article used in semiconductor manufacturing equipment assemblies (18mm or more and containing 8 percent or more but less than 24 percent by weight of nickel); fabricated stainless-steel bar, plate, tube, fastener, spring, or structural article used in semiconductor manufacturing equipment assemblies (containing 8percent or more but less than 24 percent by weight of nickel); fabricated stainless-steel bar, plate, tube, fastener, spring, or structural article used in semiconductor manufacturing equipment assemblies (less than 152.4mm and containing less than 8 percent by weight of nickel); fabricated stainless-steel bar, plate, tube, fastener, spring, or structural article used in semiconductor manufacturing equipment assemblies (of a thickness of less than 4.75 mm > other of a thickness of less than 4.75 mm); fabricated stainless-steel bar, plate, tube, fastener, spring, or structural article used in semiconductor manufacturing equipment assemblies (of a thickness of less than 4.75 mm > of a width of less than 300 mm); fabricated stainless-steel bar, plate, tube, fastener, spring, or structural article used in semiconductor manufacturing equipment assemblies (nickel-alloy); seamless stainless-steel tube or pipe manufactured for high-purity gas, vacuum, and corrosive chemical transfer applications in semiconductor fabrication (of an external diameter of less than 19 mm > other of an external diameter of less than19 mm); seamless stainless-steel tube or pipe manufactured for high-purity gas, vacuum, and corrosive chemical transfer applications in semiconductor fabrication; seamless stainless-steel tube or pipe manufactured for high-purity gas, vacuum, and corrosive chemical transfer applications in semiconductor fabrication (having a wall thickness of 4 mm or more > of alloy steel); stainless steel tube or pipe fitting including elbows, reducers, couplings, tees, or adapters used in semiconductor gas and chemical distribution systems; machined stainless-steel flange with precision sealing surfaces used for connecting semiconductor gas and chemical process piping systems; threaded stainless steel pipe connection fitting for high-purity semiconductor gas and fluid delivery systems; threaded stainless steel pipe connection fitting for high-purity semiconductor gas and fluid delivery systems (spring washers and other lock washers); threaded stainless steel pipe connection fitting for high-purity semiconductor gas and fluid delivery systems (cotters and cotter pins); copper alloy tube or pipe fitting designed for controlled gas, cooling water, or fluid transfer systems in semiconductor equipment; copper screws, pins, and washers used in semiconductor manufacturing, fluid handling, vacuum processing, or industrial automation applications; copper screws, pins, and washers used in semiconductor manufacturing, fluid ( printed page 54694) handling, vacuum processing, or industrial automation applications (having shanks, threads or holes less than 6 mm in diameter); copper screws, pins, washers used in semiconductor manufacturing, fluid handling, vacuum processing, or industrial automation applications; nickel plates/sheets used in semiconductor manufacturing, fluid handling, vacuum processing, or industrial automation applications; nickel tubes/pipes used in semiconductor manufacturing, fluid handling, vacuum processing, or industrial automation applications; nickel pipes and pipe fittings used in semiconductor manufacturing, fluid handling, vacuum processing, or industrial automation applications; flat-rolled or extruded aluminum alloy plate, sheet, bar, or profile used in semiconductor equipment frames, panels, and structural assemblies; flat-rolled or extruded aluminum alloy plate, sheet, bar, or profile used in semiconductor equipment frames, panels, and structural assemblies (body stock); flat-rolled or extruded aluminum alloy plate, sheet, bar, or profile used in semiconductor equipment frames, panels, and structural assemblies (with a thickness of 6.3 mm or less); fabricated aluminum articles including brackets, supports, clamps, shields, or mounting hardware used in semiconductor manufacturing equipment; titanium metal plate, bar, fitting, or fabricated article used for corrosion-resistant semiconductor chemical and vacuum process applications; fixed spanners and wrenches used in semiconductor manufacturing, fluid handling, vacuum processing, or industrial automation applications; vises and clamps used in semiconductor manufacturing, fluid handling, vacuum processing, or industrial automation applications; metal fittings and brackets used in semiconductor manufacturing, fluid handling, vacuum processing, or industrial automation applications; metal mountings and fittings used in semiconductor manufacturing, fluid handling, vacuum processing, or industrial automation applications; flexible stainless steel or metal hose assembly with braided reinforcement for high-purity gas and vacuum transfer systems (w/fittings); flexible stainless steel or metal hose assembly with braided reinforcement for high-purity gas and vacuum transfer systems; metal plates used in semiconductor manufacturing, fluid handling, vacuum processing, or industrial automation applications; industrial centrifugal, diaphragm, or fluid transfer pump component used in semiconductor chemical delivery and recirculation systems; vacuum pump, gas compressor, blower, or related assembly used for semiconductor wafer processing and vacuum chamber operations; tight biological safety cabinets; industrial heat exchange, thermal processing, cooling, or temperature control apparatus used in semiconductor manufacturing equipment; industrial gas, liquid, or vacuum filtration and purification apparatus including filter housing and replaceable filter elements for semiconductor process systems; air filters for industrial gas, liquid, or vacuum filtration and purification apparatus including filter housings and replaceable filter elements for semiconductor process systems; dust collectors for industrial gas, liquid, or vacuum filtration and purification apparatus including filter housings and replaceable filter elements for semiconductor process systems; gas separation equipment for industrial gas, liquid, or vacuum filtration and purification apparatus including filter housing and replaceable filter elements for semiconductor process systems; gas filters for industrial gas, liquid, or vacuum filtration and purification apparatus including filter housings and replaceable filter elements for semiconductor process systems; filter housing for semiconductor process systems; cleaning machines used in semiconductor manufacturing, fluid handling, vacuum processing, or industrial automation applications; clean strap, lock plate used in semiconductor manufacturing, fluid handling, vacuum processing, or industrial automation applications; sand blasting machine used in semiconductor manufacturing, fluid handling, vacuum processing, or industrial automation applications; lathe collets; hand grinders (polishers and sanders) used in semiconductor manufacturing, fluid handling, vacuum processing, or industrial automation applications; automatic data processing unit, controller, or industrial computer hardware used for semiconductor equipment monitoring and automation; pcbas used in semiconductor manufacturing, fluid handling, vacuum processing, or industrial automation applications; populated printed circuit board for test or development activities development; air humidifiers/dehumidifiers used in semiconductor manufacturing systems; specialized electro-mechanical motors used in semiconductor manufacturing systems; clip, cam shaft for electro-mechanical motors used in semiconductor manufacturing systems; pressure-reducing valve with machined metal body used to regulate process gas flow in semiconductor fluid delivery systems; pressure-reducing valve with machined metal body used to regulate process gas flow in semiconductor fluid delivery systems (hydraulic); pressure-reducing valve with machined metal body used to regulate process gas flow in semiconductor fluid delivery systems (having a pressure rating under 850kpa); pressure-reducing valve with machined metal (steel) body used to regulate process gas flow in semiconductor fluid delivery systems; pressure-reducing valve with machined metal body used to regulate process gas flow in semiconductor fluid delivery systems (having a pressure rating of 850 kpa or over); pressure-reducing, ball-type valve with machined metal body used to regulate process gas flow in semiconductor fluid delivery systems; hand-operated, pressure-reducing valve with machined metal body used to regulate process gas flow in semiconductor fluid delivery systems; pressure-reducing, solenoid valve with machined metal body used to regulate process gas flow in semiconductor fluid delivery systems; regulator valve with machined metal body used to regulate process gas flow in semiconductor fluid delivery systems; pressure-reducing valve with machined metal body designed for proportional operation by a signal from a control device used to regulate process gas flow in semiconductor fluid delivery systems; pressure-reducing and thermostatically controlled valve with machined metal body and pneumatic actuators used to regulate process gas flow in semiconductor fluid delivery systems; thermostatically controlled gate valve with machined metal body and pneumatic actuators used to regulate process gas flow in semiconductor fluid delivery systems—gate valve, regulator, actuator, flow restrictor, orifice; pressure-reducing valve bodies with machined metal body used to regulate process gas flow in semiconductor fluid delivery systems; parts of pressure-reducing and thermostatically controlled valve with machined metal body (steel forging) and pneumatic actuators used to regulate process gas flow in semiconductor fluid delivery systems; gas panel sub-assembly kits used in semiconductor device manufacturing; parts of gas panel for semiconductor device manufacturing, such as mounting brackets, purge assembly, side panels or enclosures; electric motors used in semiconductor manufacturing, fluid handling, vacuum processing, or industrial automation ( printed page 54695) applications (motors of an output not exceeding 37.5 w > of 18.65 w or more but not exceeding 37.5 w > other of 18.65w or more but not exceeding 37.5 w); electric motors used in semiconductor manufacturing, fluid handling, vacuum processing, or industrial automation applications (universal ac/dc motors of an output exceeding 37.5 w > exceeding 74.6 w but not exceeding 735 w); single-phase electric motors used in semiconductor manufacturing, fluid handling, vacuum processing, or industrial automation applications; static converter, power supply, transformer, reactor, or electrical power conditioning assembly for electric motors used in semiconductor manufacturing equipment; power supply for static converter, power supply, transformer, reactor, or electrical power conditioning assembly for electric motors used in semiconductor manufacturing equipment (with a power output exceeding 150 w but not exceeding 500 w); power supply for static converter, power supply, transformer, reactor, or electrical power conditioning assembly for electric motors used in semiconductor manufacturing equipment; static converter, power supply, transformer, reactor, or electrical power conditioning assembly used in semiconductor manufacturing equipment; parts of static converter, power supply, transformer, reactor, or electrical power conditioning assembly used in semiconductor manufacturing equipment; metal electromagnets used in semiconductor manufacturing, fluid handling, vacuum processing, or industrial automation applications; parts of metal electromagnets used in semiconductor manufacturing, fluid handling, vacuum processing, or industrial automation applications; parts of welding apparatus used in semiconductor manufacturing, fluid handling, vacuum processing, or industrial automation applications; heating resistors used in semiconductor manufacturing, fluid handling, vacuum processing, or industrial automation applications; switching apparatus used in semiconductor manufacturing, fluid handling, vacuum processing, or industrial automation applications; parts of switching apparatus in semiconductor manufacturing, fluid handling, vacuum processing, or industrial automation applications; lcd screens used in semiconductor manufacturing, fluid handling, vacuum processing, or industrial automation applications; parts of electrical capacitors used in semiconductor manufacturing, fluid handling, vacuum processing, or industrial automation applications; carbon film, electrical resistors used in semiconductor manufacturing, fluid handling, vacuum processing, or industrial automation applications; parts of heating resistors used in semiconductor manufacturing, fluid handling, vacuum processing, or industrial automation applications; printed circuit boards used in semiconductor manufacturing, fluid handling, vacuum processing, or industrial automation applications; rotary switches not over 5 a rating used in semiconductor manufacturing equipment and industrial automation systems; rotary switches over 5 a rating used in semiconductor manufacturing equipment and industrial automation systems; optical fiber cables used in semiconductor manufacturing equipment and industrial automation systems; lamp holders, plugs and sockets used in semiconductor manufacturing equipment and industrial automation systems; electrical couplings used in semiconductor manufacturing equipment and industrial automation systems; electrical junction boxes used in semiconductor manufacturing equipment and industrial automation systems; electric power distribution panel boards used for semiconductor manufacturing and process automation equipment (for a voltage not exceeding 1,000 v > other for a voltage not exceeding 1,000 v); electric panel boards used for semiconductor manufacturing and processing automation equipment (for a voltage not exceeding 1,000 v > other for a voltage not exceeding 1,000 v); parts of electrical enclosure, panel hardware, contact assembly, or control cabinet component used in semiconductor equipment electrical systems; printed circuit assemblies for electrical enclosure, panel hardware, contact assembly, or control cabinet component used in semiconductor equipment electrical systems; molded parts for electrical enclosure, panel hardware, contact assembly, or control cabinet component used in semiconductor equipment electrical systems; parts of led lamps designed for a voltage not exceeding 100 v used in semiconductor manufacturing, fluid handling, vacuum processing, or industrial automation applications; diodes for led lamps used in semiconductor manufacturing, fluid handling, vacuum processing, or industrial automation applications; electrical signal generators used in semiconductor manufacturing, fluid handling, vacuum processing, or industrial automation applications; pipe sealing machines, purge panels, and other accessories used in semiconductor manufacturing, fluid handling, vacuum processing, or industrial automation applications; insulated electrical conductor, cable, fiber optic assembly, or wiring harness with connectors for telecommunications (ethernet) used in semiconductor manufacturing equipment (for a voltage not exceeding 1,000 v); insulated electrical conductor, cable, fiber optic assembly, or wiring harness with connectors used in semiconductor manufacturing equipment (for a voltage not exceeding 1,000 v); cable assembly for control valve used in semiconductor manufacturing equipment; coated fiber glass insulator; convex lens used in semiconductor manufacturing, fluid handling, vacuum processing, or industrial automation applications; parts of microscope used in semiconductor manufacturing, fluid handling, vacuum processing, or industrial automation applications; handheld sealer assembly; thermocouple and other floating instruments used in semiconductor manufacturing, fluid handling, vacuum processing, or industrial automation applications; parts of thermocouples and other floating instruments used in semiconductor manufacturing, fluid handling, vacuum processing, or industrial automation applications; humidity sensor communication module used in semiconductor manufacturing, fluid handling, vacuum processing, or industrial automation applications; humidity sensors; parts of electronic instrument for measuring or monitoring liquid, gas, pressure, or flow characteristics in semiconductor process systems; pressure gauges and manometers; electronic instrument for measuring or monitoring liquid, gas, pressure, or flow characteristics in semiconductor process systems (gauge caps, manometers, pressure transducer); spectrum analyzer with recorder used in semiconductor manufacturing, fluid handling, vacuum processing, or industrial automation applications; parts of spectrum analyzer used in semiconductor manufacturing, fluid handling, vacuum processing, or industrial automation applications; gas boxes used in semiconductor manufacturing, fluid handling, vacuum processing, or industrial automation applications; parts of gas boxes used in semiconductor manufacturing, fluid handling, vacuum processing, or industrial automation applications; quartz rod for measurement used in semiconductor manufacturing, fluid handling, vacuum processing, or industrial automation applications; ( printed page 54696) pneumatic manifold or control instrument incorporating electronic sensing and feedback functions for semiconductor manufacturing equipment; parts of pneumatic manifold, automatic regulating or control instrument incorporating electronic sensing and feedback functions for semiconductor manufacturing equipment; pressure controller for gas or liquids for semiconductor manufacturing equipment; mass flow controller of gas or liquids for semiconductor manufacturing equipment; pressure controller panel mount for semiconductor manufacturing equipment; parts of pressure transducer or flow controller for semiconductor manufacturing equipment; metals parts of pressure transducer or flow controller for semiconductor manufacturing equipment; and al or stainless steel brackets for gas panels for semiconductor equipment (duty rate ranges from duty-free to 8.6%).

The request indicates that certain materials/components are subject to duties under section 232 of the Trade Expansion Act of 1962 (section 232) depending on the country of origin. The applicable section 232 decision requires subject merchandise to be admitted to FTZs in privileged foreign status (19 CFR 146.41). The request also indicates that parts of gas panel for semiconductor device manufacturing, such as mounting brackets, purge assembly, side panels or enclosures; and fabricated aluminum articles including brackets, supports, clamps, shields, or mounting hardware used in semiconductor manufacturing equipment are subject to an antidumping/countervailing duty (AD/CVD) order/investigation if imported from certain countries The Board's regulations (15 CFR 400.13(c)(2)) require that merchandise subject to AD/CVD orders, or items which would be otherwise subject to suspension of liquidation under AD/CVD procedures if they entered U.S. customs territory, be admitted to the zone in privileged foreign status (19 CFR 146.41).

Public comment is invited from interested parties. Submissions shall be addressed to the Board's Executive Secretary and sent to: ftz@trade.gov. The closing period for their receipt is October 5, 2026.

A copy of the notification will be available for public inspection in the “Online FTZ Information System” section of the Board's website.

For further information, contact John Frye at John.Frye@trade.gov.