80 FR 70837 - Notice Pursuant to the National Cooperative Research and Production Act of 1993-Silicon Integration Initiative, Inc.

DEPARTMENT OF JUSTICE
Antitrust Division

Federal Register Volume 80, Issue 220 (November 16, 2015)

Page Range70837-70838
FR Document2015-29057

Federal Register, Volume 80 Issue 220 (Monday, November 16, 2015)
[Federal Register Volume 80, Number 220 (Monday, November 16, 2015)]
[Notices]
[Pages 70837-70838]
From the Federal Register Online  [www.thefederalregister.org]
[FR Doc No: 2015-29057]


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DEPARTMENT OF JUSTICE

Antitrust Division


Notice Pursuant to the National Cooperative Research and 
Production Act of 1993--Silicon Integration Initiative, Inc.

    Notice is hereby given that, on September 28, 2015, pursuant to 
section 6(a) of the National Cooperative Research and Production Act of 
1993, 15 U.S.C. 4301 et seq. (``the Act''), Silicon Integration 
Initiative, Inc. (``Si2'') filed written notifications simultaneously 
with the Attorney General and the Federal Trade Commission disclosing 
changes in its membership. The notifications were filed for the purpose 
of extending the Act's provisions limiting the recovery of antitrust 
plaintiffs to actual damages under specified circumstances. 
Specifically, Advanced Micro Devices, Sunnyvale, CA; The National 
Institute of Advanced Industrial Science and Technology (AIST), Tokyo, 
JAPAN; Altera, San Jose, CA; ams AG, Unterpremstaetten, AUSTRIA; 
AnaGlobe Technology, Inc., Hsinchu, TAIWAN; Analog Devices, Inc., 
Norwood, MA; ANSYS, Inc., Canonsburg, PA; ARM, Cambridge, UNITED 
KINGDOM; Atoptech, Inc., Santa Clara, CA; Aurrion, Inc., Santa Barbara, 
CA; Avago Technologies, Inc., San Jose, CA; AWR/National Instruments 
Corporation, Austin, TX; Berkeley Wireless Research Center, Berkley, 
CA; Blackcomb Design Automation, Inc., Vancouver, CANADA; Broadcom 
Corporation, Irvine, CA; Concept Engineering GmbH, Freiburg, GERMANY; 
Coupling Wave Solutions, Grenoble, FRANCE; Computer Simulation 
Technology (CST), Darmstadt, GERMANY; Denso, Kariya, JAPAN; Dolphin 
Integration, Grenoble, FRANCE; eASIC Corporation, Santa Clara, CA; 
EDXACT, Voiron, FRANCE; Entasys Design, Seoul, REPUBLIC OF KOREA; 
Fractal Technologies, Los Gatos, CA; Fraunhofer Institute for 
Integrated Circuits IIS, Dresden, GERMANY; GLOBALFOUNDRIES, Santa 
Clara, CA; Huada Empyrean Software Co. Ltd./ICScape, Beijing, PEOPLE'S 
REPUBLIC OF CHINA; IMEC, Leuven, BELGIUM; Infineon Technologies, 
Nuebiberg, GERMANY; Jedat, Tokyo, JAPAN; Kenji Morohashi, Yokohama, 
JAPAN; Keysight Technologies, Santa Rosa, CA; Lattice Semiconductor 
Limited, Portland, OR; Luceda N.V., Dendermonde, BELGIUM; Lumerical 
Solutions, Inc., Vancouver, CANADA; Marvell Semiconductor, Inc., Santa 
Clara, CA; MediaTek, Hsinchu, TAIWAN,; Micron Technology, Inc., Folsom, 
CA; Monozukuri S.p.A., Rome, ITALY; NXP Semiconductors, Eindhoven, THE 
NETHERLANDS; Oracle, Redwood City, CA; PDF Solutions, Inc., San Jose, 
CA; Peregrine Semiconductor Corporation, San Diego, CA; Phoenix 
Software, Enschede, THE NETHERLANDS; ProPlus Design Solutions, San 
Jose, CA; Pulsic Limited, Bristol, UNITED KINGDOM; Qorvo, Inc., 
Richardson, TX; Qualcomm, Inc., San Diego, CA; Raytheon Company, 
Waltham, MA; Robust Chip Inc., Pleasanton, CA; Sage Design Automation, 
Santa Clara, CA; Samsung Electronics Co., Ltd., Hwasung-City, REPUBLIC 
OF KOREA; Sandia National Laboratories, Albuquerque, NM; Silicon

[[Page 70838]]

Frontline Technology, Campbell, CA; SiConTech, Inc., Austin, TX; 
Silvaco, Inc., Santa Clara, CA; SK Hynix, Inc., Icheon-si, REPUBLIC OF 
KOREA; Sony, Tokyo, JAPAN; Spectral Design & Test, Inc., Somerville, 
NJ; Semiconductor Technology Academic Research (STARC), Yokohama, 
JAPAN; Synopsys, Inc., Mountain View, CA; Taiwan Semiconductor 
Manufacturing Company Limited (TSMC), Hsinchu, TAIWAN; Teklatech A/S, 
Copenhagen, DENMARK; Texas Instruments, Dallas, TX; Thales Group, 
Paris, FRANCE; Tool Corporation, Tokyo, JAPAN; Toshiba Corporation, 
Kawasaki, JAPAN; Tyndall National Institute, Cork City, IRELAND; United 
Microelectronics Corporation (UMC), Hsinchu City, TAIWAN; and Zuken, 
Inc., Yokohama, JAPAN, have been added as parties to this venture.
    Also, Chipdata, Inc., Richardson, TX; Electronic Tools Co., Sonoma, 
CA; Ericsson, Stockholm, SWEDEN; Fujitsu Ltd., Sunnyvale, CA; Monterey 
Design Systems, Inc., Sunnyvale, CA; Multi-Gig Limited, Wellingborough, 
UNITED KINGDOM; Semiconductor Research Corporation (SRC), Research 
Triangle Park, NC; Motorola, Inc., Tempe, AZ; and Sagantec, Fremont, 
CA, have withdrawn as parties to this venture.
    No other changes have been made in either the membership or planned 
activity of the group research project. Membership in this group 
research project remains open, and Si2 intends to file additional 
written notifications disclosing all changes in membership.
    On December 30, 1988, Si2 filed its original notification pursuant 
to section 6(a) of the Act. The Department of Justice published a 
notice in the Federal Register pursuant to section 6(b) of the Act on 
March 13, 1989 (54 FR 10456).
    The last notification was filed with the Department on July 30, 
2003. A notice was published in the Federal Register pursuant to 
section 6(b) of the Act on August 29, 2003 (68 FR 52057).

Patricia A. Brink,
Director of Civil Enforcement, Antitrust Division.
[FR Doc. 2015-29057 Filed 11-13-15; 8:45 am]
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Current View
CategoryRegulatory Information
CollectionFederal Register
sudoc ClassAE 2.7:
GS 4.107:
AE 2.106:
PublisherOffice of the Federal Register, National Archives and Records Administration
SectionNotices
FR Citation80 FR 70837 

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